2016年4月12日 · Start-up speed negotiation protocol. USB 3.1 adds a new start-up speed negotiation protocol, designed to get the link up to the highest rate supported by both devices. It uses the LFPS handshake introduced in USB 3.0, adapting it slightly to turn it into a pulsewidth modulation message called LBPM (for LFPS-based PWM message).

2018年11月5日 · Figure 2 illustrates USB 3.2 lane striping and lane bonding. In USB 3.2 Gen Xx2 mode, the host and device controller run TX paths at twice the speed of a single-lane USB 3.1 or USB 3.0 connection. Payload data is split (striped) across two TX/RX lanes in the PHY and cable and combined (bonded) in the host and device controller RX paths.

2013年9月16日 · Why USB 3.0? USB 3.0 Overview. USB 3.0 Functional Layer. USB 3.0 Protocol Layer – Part 1. USB 3.0 Protocol Layer – Part 2. USB 3.0 Link Layer. USB 3.0 Physical Layer. Company info Synopsys Corporate Headquarters 700 East Middlefield Road Mountain View, CA 94043 (650) 584-5000 (800) 541-7737 www.synopsys.com

2013年9月16日 · Next => USB 3.0 Protocol Layer – part 1. Further information. If you are new to designing with USB, or looking for tips on implementing USB 3.0 IP, attend Synopsys’ “USB 3.0 University.” Topics in this instructional video series range from a basic USB overview, to implementing USB on FPGAs, to top-level synthesis, and more.

2017年3月3日 · A look at USB 3.1, which offers data rates of up to 10Gbit/s, and the way that the USB 3.1 protocol has changed to support this rate. Article | Topics: Embedded - Architecture & Design , IP - Selection | Tags: SuperSpeed , superspeedplus , Type C , USB , USB 3.1 | Organizations: Synopsys , USB.org

2018年10月9日 · The logic libraries, embedded memories, and PHYs supporting USB 2.0/3.1, DisplayPort, PCI Express 3.1, and MIPI M-PHY are available now in the N7+ process, as are the STAR Memory System and STAR Hierarchical System tools.

2017年9月26日 · Articles related to tags: HDCP. Using USB Type-C connectors to combine both USB-C 3.1 and DisplayPort data streams, to support data, audio, video and power connections on a single port

10Gbit/s USB 3.1 IP and verification support on the way USB 3.1 IP, verification IP, virtual development kit build on Synopsys' USB 3.0 DesignWare and supporting ecosystem Article | Topics: Blog - IP , - Verification | Tags: DesignWare , HAPS , USB 3.1 , VDK , VIP

2017年12月8日 · Interfaces were implemented using silicon-proven DesignWare IP for the DDR4 and PCI Express 3.1 standards. The DDR4 IP supports high-capacity DDR4 and DDR4 3D-stacked DRAM. The PCI Express 3.1 IP supports a feature called single root I/O virtualization, which makes it easier to share an SSD across multiple CPUs or operating systems.

2009年6月1日 · 1.30pm-3.00pm Poster Session and Ice Cream Social 3.00pm-4.00pm Toward Front-End Design Productivity. 6.1 Unified Chip/Package/Board Codesign Flow for Laminate, Leadframe, and Wafer-Level Packages in a Distributed Design Environment, Infineon Technologies, Cadence Design Systems, CISC Semiconductor Design+Consulting